Dr. Gerfried Zwicker has studied physics at the Technical University Berlin where he graduated on electroluminescence of II-VI semiconductors for his diploma in physics. At Fritz-Haber-Institute of the Max-Planck-Society, also in Berlin, he investigated surface properties of ZnO crystals for his dissertation. He joined the Fraunhofer Institute for Microstructure Technology IMT in 1985, where he worked on CMOS Technology by using x-ray lithography with an emphasis on reactive ion etching RIE. After his move to North Germany to the Fraunhofer Institute for Silicon Technology ISIT in Itzehoe in 1995 he concentrated on Chemical Mechanical Polishing CMP and was responsible for CMP tool development, consumables evaluation and process adoption for MEMS and powerMOS applications.
Dr. Gerfried Zwicker is founder and organizer of the European CMP Users Meeting since
around 20 years and was co-founder and member of the Executive Committee of the
International Conference on Planarization/CMP Technology ICPT until 2018.
He is author/co-author of more than 50 scientific and technical publications and
book contributions and is co-inventor of 3 patents on semiconductor technology.
After his retirement end of 2018 he offers his longtime experience in
microelectronics as an independent consultant.
More-than-Moore, which covers developments in microelectronics additional to digital functionalities (More Moore) like sensors, actuators, powerMOS, Analog, RF, etc., demands more and more for new planarization technologies. This talk will present examples of CMP processes needed for MEMS and powerMOS devices and will discuss process specifications, consumables and tool requirements and the differentiations to the seemingly advanced CMP processes for memory and logic. The use of More-than-Moore devices is increasing constantly from automotive to mobile phone to IoT applications and will further increase in the future for e.g. autonomous driving. Therefore, many new applications and opportunities for planarization technologies have to be expected.
Dr. Lieve Teugels joined imec in Belgium in 2009 as R&D engineer in the Electrodeposition, CMP and Thinning group of the Unit Process and Module division. She received a M.S. in Chemistry from the University of Leuven, Belgium and a PhD in Chemistry from the University of Chicago, Illinois,USA. She works mainly on process development of W, Cu-barrier and III-V CMP as well as fundamental CMP research on the polishing of new materials (e.g. Ru, Mo, Ni).
Dr. Hitoshi Morinaga received the B.S. degree in industrial chemistry from Tokyo University of Science in 1986, and Ph.D. in electronics from Tohoku University, Japan, in 1995. In 1986-2004, he worked for Mitsubishi Chemical Corporation, Japan, where he was engaged in development of CMP slurries for memory hard disc, cleaning solutions for semiconductor fabrication (including post Cu-CMP cleaner and RCA replacements). In 2005-2006, he was an Associate Professor of Tohoku University, where he was engaged in R&D and systematization of semiconductor wet process technology (including CMP, cleaning, etching and plating) with Prof. Ohmi. In 2006, he joined FUJIMI Incorporated and has been engaged in development of CMP technologies applied for various applications including semiconductor devices, LED, FPD and industrial design. Dr. Morinaga is presently responsible for new business division at FUJIMI Incorporated, Chairman of FUJIMI Shenzhen Technology, and an executive committee member of Planarization and CMP Society, Japan.Abstract:
To expand into new applications of CMP technologies, it is necessary to develop polishing technologies for a diverse range of materials and shapes. Recent advances in CMP technologies applied to various materials, 3D shapes, and using novel mechanisms that are helping to realize these challenges will be discussed.
Chih Chen received the 2016 National Innovation Award, 2017 Outstanding Technology Transfer Award on Electroplating and Application of High (111)-oriented Nanotwinned Cu, 2018 Outstanding Researcher Award, Ministry of Science & Technology, Taiwan. TMS 2018 Application to Practice Award, The Minerals, Metals & Materials Society, USA. His current research interests are reliabilities of microbumps for 3D IC, fabrication and applications of nanotwinned Cu, and low-temperature Cu-to-Cu direct bonding.
David Mezerette is Application Manager, Strategic Accounts, at NOVA Measuring Instruments, Inc. He brings more than eight years of expertise in the development and deployment of optical metrology solutions both for Logic and Memory customers.
Previously, as lead researcher at FOI, he directed the engineering efforts to develop new plasma sources for 300mm plasma etcher and asher. Dr. Mezerette carried out his early research at the Department of Electrical Engineering of the University of Nagoya (Japan), working on plasma characterization and thin film deposition. He holds a PhD in Materials Science and Engineering of the National Polytechnic Institute of Lorraine (France). He has published numerous papers, patents and books.
Wei-Hsin Tien is currently an assistant professor in the department of mechanical engineering at National Taiwan University of Science and Technology since 2014. He received his PhD in Aeronautics and astronautics at University of Washington. He earned Bachelor and Master Degrees in Mechanical Engineering and Power Mechanical Engineering from National Taiwan University and National Tsing Hua University both in Taiwan, respectively. He was a visiting scholar at Universität der Bundeswehr München, Germany and a post-doctor at University of Washington. His main research interests are quantitative flow visualization techniques to measure velocity /temperature/pressure in the fluid flow and microscale flow phenomenon in acoustofluidics and microfluidics.Abstract:
CMP (Chemical-Mechanical Polishing) is one of the key part of the modern semiconductor manufacturing process. In spite of its wide usage as the main planarization technique demanded by advanced lithography and multilevel metallization, much of the physics behind CMP is not completely understood. One of the interesting complexity comes from the slurry flow and the concentration distribution in between the rotating wafer and pad. Due to the complex phenomena at the wafer–pad interface during the CMP process, experimental methods are more appropriate because the development of computational fluid dynamics (CFD) modeling requires more experimental data for validation or even as the input to study the hydrodynamics of slurry flow. Flow visualization (FV) techniques have been applied for this purpose in the past decade. Using color or fluorescent dye, the slurry motion on the pad or even the flow at the wafer–pad interface can be visualized, if the wafer is replaced by a transparent material. Quantitative data, e.g., slurry concentration, can be calculated if more advanced technique such as laser induced fluorescence (LIF) is used. In this presentation, a review of the published works will be given and the unique challenges in visualizing CMP slurry flow will be discussed. Promising new techniques, such as temperature sensitive paint and three-dimensional velocimetry techniques will also be introduced.
Chemical Mechanical Planarization User Group
National Taiwan University of Science and Technology
Taiwan Tech Global Research and Industry Alliance (GLORIA)
Taiwan Society for Abrasive Technology (TSAT)
Department of Materials Science and Engineering, NCTU
Metal Industries Research & Development Centre