Conference Schedule


Download The Program Book

Sept. 15, 2019 (Sunday)
Time Event / Place
08:20
|
08:50
Tutorial Registration
(11F)
08:50
|
18:00
Tutorial
(Ballroom D, 11F)
16:00
|
18:00
Conference Registration
(10F)
18:00
|
Welcome Reception

Sept. 16, 2019 (Monday)
Time Topic / Speaker / Place
07:30
|
18:00
Conference Registration
08:10
|
08:30
Opening Ceremony
08:30
|
09:05
Keynote Speech 1: CMP: an overview, the good and not so good
Speaker: Prof. Suryadevara Babu
Clarkson University
09:05
|
10:10
Session A : FEOL / Emerging technologies in CMP I
10:10 - 10:30 Break & Exhibition
10:30
|
12:05
Session B: BEOL I / Emerging technologies in CMP II
12:05 - 13:00 Lunch
13:00
|
13:35
Keynote Speech 2: Challenges and Direction for Next Generation CMP
Speaker: JongHeun Lim
Samsung Electronics
13:35
|
14:50
Session C: BEOL II / Defects, reliability issues and Post CMP cleaning I
14:50 - 15:10 Break & Exhibition
15:10
|
16:30
Session D: 3D ICs / Defects, reliability issues and Post CMP cleaning II
16:30 - 16:40 Session Break
16:40
|
17:40
Session E: Defects, reliability issues and Post CMP cleaning III
18:00
|
Social night

Sept. 17, 2019 (Tuesday)
Time Topic / Speaker / Place
07:30
|
18:00
Conference Registration
08:30
|
09:05
Keynote Speech 3: Ahead CMP, Beyond CMP - More CMP, More than CMP, Beyond CMP –
Speaker: Dr. Manabu Tsujimura
Ebara Corporation
09:05
|
10:10
Session F: Process control / CMP fundamentals, modeling and simulation I
10:10 - 10:30 Break & Exhibition
10:30
|
12:05
Session G: Equipment and metrology / Defect & reliability issues and Post CMP cleaning IV
12:05 - 13:00 Lunch
13:00
|
14:50
Session H: CMP fundamentals, modeling and simulation II
14:50 - 15:10 Break & Exhibition
15:10
|
17:00
Session I: CMP fundamentals, modeling and simulation III / CMP consumables I
17:00
|
18:00
Poster Session and Exhibition
(Ballroom D, 11F)
19:00
|

Banquet
&
ICPT2020 Presentation


Sept. 18, 2019 (Wednesday)
Time Topic / Speaker / Place
07:30
|
12:00
Conference Registration
08:30
|
09:05
Keynote Speech 4: Polishing of silicon, sapphire, silicon carbide and diamond wafers: fundamentals and practice
Speaker: Prof. Liangchi Zhang
University of New South Wales
09:05
|
10:10
Session J: CMP consumables II
10:10 - 10:30 Break & Exhibition
10:30
|
11:50
Session K: CMP for MEMS / CMP consumables III
12:00 - 12:20 Student Award and Closing Remark
13:00
|

Technical Tour






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