News

Date Contents
2019/08/13 Instruction for presentation is announced.
2019/08/13 The floor plan of venue is announced.
2019/07/26 The deadline of Final Extended Abstract Submission is postponed to July 31, 2019.
2019/07/19 The deadline of Final Extended Abstract Submission is postponed to July 26, 2019.
2019/07/11 ICPT2019 tour programs now are available.
2019/07/08 ICPT2019 tutorial program now is available.
2019/07/02 The deadline of eary bird registration is postponed to July 12, 2019.
2019/07/02 The date of author notification is postponed to July 5, 2019.
2019/06/27 The date of author notification is postponed to July 2, 2019.
2019/05/16 The deadline of abstract submission is postponed to May 31, 2019.
2019/05/13 Registration is open. Please click here for more detail.
   
   

Conference Information


ICPT Background

CMP (chemical mechanical planarization), as one of the most important processes in the semiconductor manufacturing, has been developed and improved continuously year after year. It has built a certain position in related industries, and is expanding in its applied area. From the user's point of view, technical demand is becoming higher and higher, and additional applications beyond the semiconductor area are increasing.

ICPT (International Conference on Planarization/CMP Technology), is a magnificent opportunity to have discussions on CMP technologies, including FEOL and BEOL CMP, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, 3D/TSV, Metrology, Cleaning, Defect Control, Process Control, etc. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely.


Call for Papers

Abstract Submission Deadline: April 30, 2019 May 31, 2019
Author Notification: June 30, 2019 July 5, 2019
Final Extended Abstract Submission: July 19, 2019 July 31, 2019

Topic

The program committee welcomes the submission of abstracts for ICPT 2019. Abstracts of original work are requested on the following topics:

  1. FEOL CMP
  2. BEOL CMP
  3. Defects, reliability issues and Post CMP cleaning
  4. CMP fundamentals, modeling and simulation
  5. Equipment and metrology
  6. Process control
  7. Emerging technologies in CMP
  8. CMP consumables
  9. 3D Ics/TSV applications
  10. Alternative CMP technologies
  11. CMP for MEMS
  12. Hybrid IC

Submission Guidelines

Abstracts will be scored according to the originality and significance of the work as well as the quality of the information and data included. Please indicate the preference of oral or poster presentation, and the targeted topic area when submitting the abstract. Submit abstracts online, using the template provided. The deadline for submitting abstracts is April 30, 2019 May 31, 2019.
At this stage (before April 30, 2019), authors could choose to submit short abstract or extended abstract; however, at the final stage (after notification of acceptance is given on June 30, 2019), only extended abstract will be accepted. Presentation of accepted papers at the Conference must be in English.

Notice:

  1. Please be sure to use the template provided here. Short abstract/Extended abstract.
  2. The abstract should be submitted online with PDF format.


Short Abstract Template (MS Word Format)


Extended Abstract Template (MS Word Format)


On-line Submission


Author Notification

All submitted abstracts will be reviewed by peers and the Technical committee reserves the right to accept or reject papers for inclusion in the program. Notices of acceptance of abstract will be sent out to authors by
June 30, 2019.


Final Extended Abstract Submission

Final extended abstract submission, including figures, tables and references (must not exceed 2 printed pages) should be submitted online upon the notice of accepted abstracts. Extended abstracts are due on
July 19, 2019 July 31, 2019.


Copyright Agreement


Copyright Agreement


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