CMP (chemical mechanical planarization), as one of the most important processes in the semiconductor manufacturing, has been developed and improved continuously year after year. It has built a certain position in related industries, and is expanding in its applied area. From the user's point of view, technical demand is becoming higher and higher, and additional applications beyond the semiconductor area are increasing.
ICPT (International Conference on Planarization/CMP Technology), is a magnificent opportunity to have discussions on CMP technologies, including FEOL and BEOL CMP, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, 3D/TSV, Metrology, Cleaning, Defect Control, Process Control, etc. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely.
Call for Papers
|Abstract Submission Deadline: April 30, 2019|
|Author Notification: June 30, 2019|
|Final Extended Abstract Submission: July 31, 2019|
The program committee welcomes the submission of abstracts for ICPT 2019. Abstracts of original work are requested on the following topics:
Abstracts will be scored according to the originality and significance of the work as well as the quality of
the information and data included. Please indicate the preference of oral or poster presentation, and the
targeted topic area when submitting the abstract. Submit abstracts online, using the template provided. The
deadline for submitting abstracts is April 30, 2019.
At this stage (before April 30, 2019), authors could choose to submit short abstract or extended abstract; however, at the final stage (after notification of acceptance is given on June 30, 2019), only extended abstract will be accepted. Presentation of accepted papers at the Conference must be in English.
All submitted abstracts will be reviewed by peers and the Technical committee reserves the right to accept
or reject papers for inclusion in the program. Notices of acceptance of abstract will be sent out to authors
June 30, 2019.
Final Extended Abstract Submission
Final extended abstract submission, including figures, tables and references (must not exceed 2 printed
pages) should be submitted online upon the notice of accepted abstracts. Extended abstracts are due on
July 31, 2019.
Chemical Mechanical Planarization User Group
National Taiwan University of Science and Technology
Taiwan Tech Global Research and Industry Alliance (GLORIA)
Taiwan Society for Abrasive Technology (TSAT)
Department of Materials Science and Engineering, NCTU
Metal Industries Research & Development Centre